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CMP Slurry Product List and Ranking from 4 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Apr 22, 2026～May 19, 2026
This ranking is based on the number of page views on our site.

CMP Slurry Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Apr 22, 2026～May 19, 2026
This ranking is based on the number of page views on our site.

  1. 北川グレステック 本社 Chiba//Trading company/Wholesale
  2. サミットスーパーアブレーシブ Hyogo//Manufacturing and processing contract
  3. 北京国瑞升科技股份有限公司 China//Manufacturing and processing contract
  4. 4 null/null
  5. 5 TOPPANインフォメディア Tokyo//others
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CMP Slurry Product ranking

Last Updated： Aggregation Period:Apr 22, 2026～May 19, 2026
This ranking is based on the number of page views on our site.

  1. CMP slurry サミットスーパーアブレーシブ
  2. CMP slurry 北川グレステック 本社
  3. CMP slurry 北京国瑞升科技股份有限公司
  4. 4 CMP slurry 北川グレステック 本社
  5. 5 2025-2026 Edition: Current Status and Future Outlook of CMP Slurries for Semiconductors

CMP Slurry Product List

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CMP slurry

CMP slurry

Widely customizable CMP slurry

CMP (Chemical Mechanical Polishing) slurry is used in the semiconductor manufacturing process to polish the surface of substrates. Chemical etching softens the material, and mechanical abrasion removes the material, resulting in the flattening of the original three-dimensional shape. This is the mechanism of CMP. Our CMP slurry has a proven track record for various applications, including copper wiring for semiconductor circuit miniaturization and speed enhancement, low-temperature sputtering for cost-effective aluminum wiring, and compounds that excel in high-speed signal processing. It is composed of a chemical reaction solution and nano-sized polishing particles, characterized by minimal generation of coarse particles and sedimentation, ensuring stable quality. *Please feel free to contact us.*

  • Wafer processing/polishing equipment
  • CMP Slurry

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CMP slurry

CMP slurry

CMP slurry

Features ◆ Uniform particle size (sharp particle size distribution, spherical particles). ◆ High efficiency (unique formulation, stable pH). ◆ High flatness (surface quality: Ra < 0.2 nm, TTV < 3 μm). ◆ High number of circulation uses. ◆ Capable of low-temperature polishing (below 35°C). ◆ We offer a specially formulated slurry for processing SIC wafers. ◆ Neutral and weakly acidic slurries are available for aluminum nitride processing.

  • Other abrasives
  • Other consumables
  • CMP Slurry

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CMP slurry

CMP slurry

CMP slurry

CMP slurry is a silica slurry optimized specifically for polishing processes of materials such as sapphire, SiC wafers, aluminum nitride, ceramics, and metals. It has excellent particle size uniformity, high dispersion stability, and produces a uniform and good finishing surface.

  • others
  • CMP Slurry

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CMP slurry (chemical mechanical polishing liquid abrasive)

CMP slurry (chemical mechanical polishing liquid abrasive)

We can provide CMP slurries that meet customer needs for the flattening of semiconductor substrates with mixed materials.

Our company develops and manufactures CMP slurries. CMP stands for Chemical Mechanical Polishing, which involves mechanical removal and polishing while chemically dissolving materials. The chemical actions applied depend on the chemical properties of the material to be removed. The CMP slurry for semiconductor copper wiring is mass-produced for advanced devices and has gained high trust as it has been certified as a partner by major electronics manufacturers. We are also advancing the development of CMP slurries for cutting-edge devices. [Our company offers contract manufacturing of various slurries and coatings] If you have any issues with manufacturing, please feel free to contact us.

  • Other semiconductors
  • CMP Slurry

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CMP slurry

CMP slurry

Stable quality is a characteristic! Introducing the properties of "alumina" and "silica" as well as the polishing targets!

Our company conducts slurry development and manufacturing based on the experience we have cultivated since our founding. "CMP slurry" is composed of chemical solutions and nano-sized abrasive particles, characterized by minimal generation of coarse particles and good particle dispersion, ensuring stable quality. We offer "alumina," which provides excellent cleaning properties and a fast polishing rate, and "silica," which achieves damage-free results with high surface roughness. 【Features】 <Alumina> ■ Properties: Excellent cleaning properties and fast polishing rate ■ Polishing targets: Resins, compound ceramics <Silica> ■ Properties: Damage-free with high surface roughness ■ Polishing targets: Oxide films, metal film resins, glass *For more details, please refer to the PDF document or feel free to contact us.

  • Other abrasives
  • CMP Slurry

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